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Key Responsibilities
TSAXS Modeling & Application Development
Develop and apply physics-based scattering models, including interpretation of reciprocal space features and scattering from periodic nanostructures.
Build and optimize model-based fitting approaches to extract critical dimensional and material parameters.
Interpret complex scattering data and translate results into physically meaningful and actionable insights.
Evaluate and improve model robustness, parameter sensitivity, and fitting stability across varying sample conditions.
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Data Analysis & Method Development
Utilize existing analysis software to perform advanced data fitting, parameter extraction, and statistical evaluation.
Identify optimal modeling strategies for new structures, including geometry selection, parameter constraints, and fitting workflows.
Troubleshoot challenging datasets, including issues related to model non-uniqueness, correlation, and convergence.
Develop best-known methods (BKMs) for data analysis and application workflows.
Customer Engagement & Technical Support
Work closely with internal teams and key customers to understand measurement challenges and deliver effective solutions.
Support early tool deployments, application bring-up, and critical customer evaluations.
Provide high-level technical guidance on model selection, fitting strategy, and data interpretation.
Communicate complex technical results clearly to both expert and non-expert audiences.
Cross-Functional Collaboration
Partner with R&D and product teams to provide feedback on application requirements and software capabilities.
Help translate customer needs into requirements for future algorithm and software development.
Collaborate with field applications teams to ensure successful handoff and scaling of new applications.
Qualifications
Ph.D. or M.S. in Materials Science, Physics, Electrical Engineering, or a related field.
Experience in semiconductor metrology, process characterization, or thin-film/nanostructure analysis.
Demonstrated experience working with scattering-based techniques (e.g., SAXS, CD-SAXS, XRD, XRR, or related methods).
Experience with model-based data analysis and parameter extraction from experimental measurements.
Technical Skills
Strong understanding of X-ray scattering physics and diffraction-based measurement techniques.
Experience with model-based fitting approaches.
Ability to analyze complex datasets and understand parameter sensitivity, correlation, and uncertainty.
Familiarity with statistical analysis and data interpretation in experimental contexts.
Experience using commercial or in-house metrology software tools for data analysis (no software development required).
Preferred Skills
Familiarity with advanced semiconductor structures (e.g., 3D NAND, DRAM, advanced logic nodes, patterning).
Experience with inverse modeling of scattering data, including challenges related to non-unique solutions and parameter correlation.
Experience developing best-known methods (BKMs) or standardized analysis workflows.
Background in optical or x-ray scatterometry (OCD) or similar model-based metrology techniques.
Experience supporting customer-facing technical engagements or field applications.
Ability to work effectively in ambiguous, early-stage application environments.
Japanese language proficiency (spoken and/or written) and experience collaborating with Japan-based engineering teams is strongly preferred.
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